Atomic layer deposition (ALD) is a chemical vapor deposition method based on ordered, surface self saturation reactions, which can deposit substances layer by layer on the substrate surface in the form of single atomic films. Atomic layer deposition technology can be used to grow perfect conformal coatings (such as aluminum oxide, titanium oxide, etc.) on three-dimensional substrates. The grown thin film coatings have excellent moisture-proof and anti-oxidation properties, and the thickness can be precisely controlled by the number of cycles.