On May 14th, Shanghai Paralon New Materials will debut at the 2026 Heat Dissipation Technology Industry Conference and release a new generation of protective coatings
With the acceleration of the AI computing age, cutting-edge fields such as consumer electronics, autonomous driving, and humanoid robots continue to break through, driving the rapid development of chips and electronic devices towards miniaturization and high integration. The power consumption per unit area is exponentially increasing, and thermal management has become a core bottleneck for the upgrading of the manufacturing industry. In this context, the “2026 Active and Passive Heat Dissipation Technology Industry Conference” will be held from May 13th to 15th, with more than 600 industry elites gathering to discuss the cutting-edge progress and future directions of thermal management technology. Shanghai Paralon New Materials Co., Ltd., as an innovative pioneer in the field of thermal management materials, has been invited to attend the conference and will deliver a keynote speech titled “New Generation Protective Coatings” at the Active Heat Dissipation Sub Forum on the afternoon of May 14th, showcasing its latest technological achievements comprehensively.
Speech topic: New generation protective coating
Address: Sheraton Shanghai Jiading Hotel (Jiatang Road)
Date: May 14th, 2026
1-on-1 exclusive appointment communication:
This conference focuses on active and passive cooling technologies for high-power devices, bringing together mainstream terminal manufacturers such as iPhone, Huawei, Xiaomi, DJI, and Xiaopeng, as well as core enterprises in the upstream and downstream of the industry chain. It is committed to creating a high-end platform that integrates technology exchange, industry collaboration, and resource docking. The conference sets four core topics, covering active heat dissipation technology, innovation of thermal conductive materials, upgrading of heat dissipation components, and terminal thermal management solutions, comprehensively covering key technological nodes in the industry. Among them, active heat dissipation technology will be the focus of discussion, with a particular emphasis on the application progress of cutting-edge solutions such as micro fans and control modules, piezoelectric micro pump liquid cooling modules, and semiconductor refrigeration modules; In the field of thermal conductive materials, in-depth discussions are conducted on the research and industrialization of new materials such as thermal conductive silicone grease, graphene materials, and liquid metals.
Against the backdrop of continuous improvement in electronic device integration, traditional passive heat dissipation is no longer able to meet the stringent requirements of high-power scenarios, and active heat dissipation is gradually becoming a core element of industry competition. Shanghai Paralon New Materials has been deeply involved in the field of thermal management materials for many years, relying on continuous technological innovation and profound research and development accumulation to achieve breakthrough progress in the direction of protective coatings. The upcoming new generation protective coating targets the heat dissipation pain points of high-power electronic devices accurately, integrating advanced material formulations and precision preparation processes. It not only has excellent thermal conductivity, but also has efficient protection capabilities, effectively responding to the challenges of complex working conditions such as high temperature and corrosion on electronic devices.
It is reported that the new generation of protective coating uses nanoscale composite materials to achieve synergistic improvement of thermal conductivity and protective performance, while exhibiting better wear resistance and corrosion resistance, and can operate stably in the extreme temperature range of -50 ℃ to 200 ℃. This means that the new generation of protective coatings not only provides excellent protective performance, but also has a smaller impact on heat dissipation, especially suitable for high-power and highly integrated electronic devices, which can effectively reduce heat accumulation and avoid the phenomenon of “smoldering”. In addition, the coating has excellent electrical insulation and substrate adhesion, which can be widely adapted to the thermal management system of various high-power terminal devices such as mobile phones, drones, optical modules, humanoid robots, etc., providing reliable and long-term heat dissipation guarantee for the devices.
Yang Bo, the R&D Director of Shanghai Paralon New Materials, said, “With the rapid development of AI computing power, the requirements for thermal management in electronic devices are becoming increasingly stringent. We hope to provide the industry with more efficient and reliable heat dissipation solutions through the release of the new generation of protective coatings. This conference is not only a showcase of technological achievements, but also an important opportunity for in-depth communication with industry chain partners and jointly promoting technological innovation and industrial synergy
As an annual event in the field of thermal management, the “2026 Active and Passive Heat Dissipation Technology Industry Conference” will build a bridge for the deep integration of technology, talent, and capital. The heavyweight debut of Shanghai Paralon New Materials not only injects innovative vitality into the conference, but also provides new ideas for the technological evolution of the industry. We look forward to witnessing more breakthrough achievements like the new generation of protective coatings at this conference, and working together to help the industry continue to soar in the era of AI computing power.
