In the field of microelectronics, the application of Parylene has developed rapidly in recent years. Parylene prepared by vacuum vapor deposition can not only produce fine sized coatings, but also can be etched and patterned using microelectronic processing techniques. In addition to being used as a passivation material for microelectronic devices and a lead reinforcement packaging material, it is also used as a low dielectric constant material for integrated circuits in the production of ultra large scale integrated circuits below micrometers. Especially fluorinated Parylene, it is favored by foreign integrated circuit researchers as an interlayer insulation medium for multi-layer integrated ultra large scale integrated circuits.